Koch Chemie Micro Cut 125 mm Soft Polishing Pad

With the Koch Chemie Micro Cut Foam Pad 125 mm, you get a professional polishing pad designed for the final, crucial steps of the polishing process. The pad’s fine cell structure ensures even distribution of the polishing compound and provides a perfect finish without holograms.

Features & benefits

• Fine polishing pad (finish) – specially developed for hologram-free polishing
• 125 mm diameter – fits standard polishing machines with a 125 mm (5") backing plate
• Open cell structure – provides efficient heat dissipation and long working time
• Optimized for Micro Cut polishes – e.g., Koch Chemie M3.02 or F6.01 for the final step
• Professional quality – can be used by both enthusiasts and professional detailers

The pad is particularly suitable as a finishing pad after heavy and medium polishing, where it delivers deep gloss and a factory-new look to the paintwork.

How to use the Koch Chemie Micro Cut Foam Pad

1. Mount the pad on a polishing machine with a 125 mm backing plate.
2. Apply a small amount of fine polishing compound (e.g., Micro Cut M3.02) to the pad or directly onto the panel.
3. Start polishing at a low speed and distribute the product.
4. Work in overlapping passes with moderate pressure until the desired gloss and clarity are achieved.
5. Wipe off with a microfiber cloth and inspect the result in good lighting.

Tip: Keep the pad clean during polishing – use a pad brush or compressed air to extend its service life and ensure a consistent finish.